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Package View. Surface Mount Package. Weight: 0.006 grams (Approximately) Max Soldering Temperature +260°C for 30 secs as per JEDEC. J-STD-020. Case Material - Molded Plastic, UL Flammability Rating 94V-0. Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 e3.
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SOT353 Datasheet(PDF) - NXP Semiconductors
Description. The 74AHCT1G125 is a single non-inverting buffer/bus driver. with a 3-state output. The output enters a high impedance. state when a HIGH-level is applied to the output enable (OE) pin. The device is designed for operation with a power. supply range of 4.5V to 5.5V.
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Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material; SOT353: SOT353: surface mount: double: SOT: 2 x 1.25 x 0.95
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Terminal position code. (double) Package type descriptive code. SOT353. Package type industry code. TSSOP5. Package style descriptive code. SOT (small outline transistor)
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plastic, surface-mounted package; 5 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body. Marcom graphics. 2017-01-28. SOT353_115. Tape reel SMD; standard product orientation 12NC ending 115. Packing information. 2020-04-27. SOT353_125. Tape reel SMD; reversed product orientation 12NC ending 125.
PDF SOT353 - NXP Semiconductors
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